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Product details

374324B60023G

Availability on request

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Category: Heat Sinks
Package: Bulk

Description

Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level

Datasheet View datasheet

Specifications

Attachment Method: Solder Anchor
Base Product Number: 374324
Diameter: -
Fin Height: 0.394" (10.00mm)
Length: 1.063" (27.00mm)
Material: Aluminum
Material Finish: Black Anodized
Mfr: Aavid, Thermal Division of Boyd Corporation
Package: Bulk
Package Cooled: BGA, FPGA
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Series: 37432
Shape: Square, Pin Fins
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 30.60°C/W
Type: Board Level
Width: 1.063" (27.00mm)