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110991228 product image

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Product details

110991228

Availability on request

Manufacturer
Seeed Technology Co., Ltd
Category
Heat Sinks
Package
Not provided

Description

Heat Sink Raspberry Pi 3 B+ Copper Board Level

Specifications
Attachment Method
Thermal Tape, Adhesive (Included)
Diameter
-
Fin Height
-
Length
-
Material
Copper
Material Finish
-
Mfr
Seeed Technology Co., Ltd
Package
Bulk
Package Cooled
Raspberry Pi 3 B+
Power Dissipation @ Temperature Rise
-
Series
-
Shape
Rectangular
Shelf Life
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Type
Board Level
Width
-