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Product details

833900T00000

Availability on request

Manufacturer: Comair Rotron
Category: Heat Sinks
Package: Bulk

Description

Heat Sink TO-263 (D²Pak) Copper 2.0W @ 40°C Board Level

Datasheet Not provided

Specifications

Attachment Method: SMD Pad
Diameter: -
Fin Height: 0.375" (9.52mm)
Length: 0.591" (15.00mm)
Material: Copper
Material Finish: Tin
Mfr: Comair Rotron
Package: Bulk
Package Cooled: TO-263 (D²Pak)
Power Dissipation @ Temperature Rise: 2.0W @ 40°C
Series: -
Shape: Rectangular, Fins
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 400 LFM
Thermal Resistance @ Natural: -
Type: Board Level
Width: 1.020" (25.91mm)