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Product details

834000T00000

Availability on request

Manufacturer: Comair Rotron
Category: Heat Sinks
Package: Bulk

Description

Heat Sink TO-263 (D²Pak) Copper 1.5W @ 20°C Board Level

Datasheet Not provided

Specifications

Attachment Method: SMD Pad
Diameter: -
Fin Height: 0.450" (11.43mm)
Length: 0.763" (19.38mm)
Material: Copper
Material Finish: Tin
Mfr: Comair Rotron
Package: Bulk
Package Cooled: TO-263 (D²Pak)
Power Dissipation @ Temperature Rise: 1.5W @ 20°C
Series: -
Shape: Rectangular, Fins
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 200 LFM
Thermal Resistance @ Natural: -
Type: Board Level
Width: 1.000" (25.40mm)