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50-01-0584-0208 product image

Image shown for reference. Confirm specifications in the datasheet.

Product details

50-01-0584-0208

Availability on request

Manufacturer
Parker Chomerics
Category
RFI and EMI - Shielding and Absorbing Materials
Package
Bulk

Description

RF EMI EMI Conductive Adhesive CHO-BOND® 584-208 Epoxy, 2 Part X X

Specifications
Adhesive
-
Base Product Number
50-01
Length
-
Material
Epoxy, 2 Part
Mfr
Parker Chomerics
Operating Temperature
-
Package
Bulk
Series
CHO-BOND® 584-208
Shape
-
Shelf Life
9 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
77°F (25°C)
Thickness - Overall
-
Type
EMI Conductive Adhesive
Width
-