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XCZU3CG-L1SFVA625I product image

Image shown for reference. Confirm specifications in the datasheet.

Product details

XCZU3CG-L1SFVA625I

Availability on request

Manufacturer
AMD Xilinx
Category
System On Chip (SoC)
Package
Tray

Description

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 500MHz, 1.2GHz 625-FCBGA (21x21)

Datasheet Not provided
Specifications
Architecture
MCU, FPGA
Base Product Number
XCZU3
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size
-
Mfr
AMD Xilinx
Number of I/O
180
Operating Temperature
-40°C ~ 100°C (TJ)
Package
Tray
Package / Case
625-BFBGA, FCBGA
Peripherals
DMA, WDT
Primary Attributes
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
RAM Size
256KB
Series
Zynq® UltraScale+™ MPSoC CG
Speed
500MHz, 1.2GHz
Supplier Device Package
625-FCBGA (21x21)