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XCVM1402-2MSINSVF1369 product image

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Product details

XCVM1402-2MSINSVF1369

Availability on request

Manufacturer
AMD Xilinx
Category
System On Chip (SoC)
Package
Tray

Description

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ Prime Versal™ Prime FPGA, 1.2M Logic Cells 600MHz, 1.4GHz 1369-BGA (35x35)

Datasheet Not provided
Specifications
Architecture
MPU, FPGA
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core Processor
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size
-
Mfr
AMD Xilinx
Number of I/O
424
Operating Temperature
-40°C ~ 100°C (TJ)
Package
Tray
Package / Case
1369-BFBGA
Peripherals
DDR, DMA, PCIe
Primary Attributes
Versal™ Prime FPGA, 1.2M Logic Cells
RAM Size
-
Series
Versal™ Prime
Speed
600MHz, 1.4GHz
Supplier Device Package
1369-BGA (35x35)

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