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XCZU57DR-2FFVE1156I product image

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Product details

XCZU57DR-2FFVE1156I

Availability on request

Manufacturer
AMD Xilinx
Category
System On Chip (SoC)
Package
Tray

Description

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ RFSoC DR Zynq® UltraScale+™ RFSoC 533MHz, 1.3GHz 1156-FCBGA (35x35)

Datasheet Not provided
Specifications
Architecture
MPU, FPGA
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size
-
Mfr
AMD Xilinx
Number of I/O
-
Operating Temperature
-40°C ~ 100°C (TJ)
Package
Tray
Package / Case
1156-BBGA, FCBGA
Peripherals
DDR, DMA, PCIe, WDT
Primary Attributes
Zynq® UltraScale+™ RFSoC
RAM Size
-
Series
Zynq® UltraScale+™ RFSoC DR
Speed
533MHz, 1.3GHz
Supplier Device Package
1156-FCBGA (35x35)

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