Skip to main content
Dechoele
Prepare BOM Enquiry Request a Quote
XCVM1802-1LSEVSVA2197 product image

Image shown for reference. Confirm specifications in the datasheet.

Product details

XCVM1802-1LSEVSVA2197

Availability on request

Manufacturer
AMD Xilinx
Category
System On Chip (SoC)
Package
Tray

Description

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ Prime Versal™ Prime FPGA, 1.9M Logic Cells 400MHz, 1GHz 2197-FCBGA (45x45)

Datasheet Not provided
Specifications
Architecture
MPU, FPGA
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core Processor
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size
-
Mfr
AMD Xilinx
Number of I/O
770
Operating Temperature
0°C ~ 100°C (TJ)
Package
Tray
Package / Case
2197-BFBGA, FCBGA
Peripherals
DDR, DMA, PCIe
Primary Attributes
Versal™ Prime FPGA, 1.9M Logic Cells
RAM Size
256KB
Series
Versal™ Prime
Speed
400MHz, 1GHz
Supplier Device Package
2197-FCBGA (45x45)

Continue browsing

These products share the same category. Suitability must be confirmed independently.