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TDA3MVRBFABFRQ1 product image

Image shown for reference. Confirm specifications in the datasheet.

Product details

TDA3MVRBFABFRQ1

Availability on request

Manufacturer
Texas Instruments
Category
System On Chip (SoC)
Package
Tape & Reel (TR)

Description

ARM® Cortex®-M4, C66x System On Chip (SOC) IC - 212.8MHz, 745MHz 367-FCBGA (15x15)

Datasheet Not provided
Specifications
Architecture
DSP, MPU
Connectivity
CAN, MMC/SD/SDIO, McASP, I²C, SPI, UART, USB
Core Processor
ARM® Cortex®-M4, C66x
Flash Size
-
Mfr
Texas Instruments
Number of I/O
126
Operating Temperature
-40°C ~ 125°C (TJ)
Package
Tape & Reel (TR)
Package / Case
367-BFBGA, FCBGA
Peripherals
DMA, PWM, WDT
Primary Attributes
-
RAM Size
512kB
Series
-
Speed
212.8MHz, 745MHz
Supplier Device Package
367-FCBGA (15x15)