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208-7391-55-1902 product image

Image shown for reference. Confirm specifications in the datasheet.

Product details

208-7391-55-1902

Availability on request

Manufacturer
3M
Category
IC Sockets
Package
Bulk

Description

8 (2 x 4) Pos SOIC Socket Gold Through Hole

Specifications
Base Product Number
208
Contact Finish - Mating
Gold
Contact Finish - Post
Gold
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Finish Thickness - Post
30.0µin (0.76µm)
Contact Material - Mating
Beryllium Copper
Contact Material - Post
Beryllium Copper
Contact Resistance
-
Current Rating (Amps)
1 A
Features
Closed Frame
Housing Material
Polyethersulfone (PES), Glass Filled
Material Flammability Rating
UL94 V-0
Mfr
3M
Mounting Type
Through Hole
Number of Positions or Pins (Grid)
8 (2 x 4)
Operating Temperature
-55°C ~ 150°C
Package
Bulk
Pitch - Mating
-
Pitch - Post
-
Series
Textool™
Termination
Solder
Termination Post Length
0.140" (3.56mm)
Type
SOIC