Compare |
Mfr Part # |
RoHS |
Pricing(USD) |
Inventory |
Description |
Package |
|
Quantity |
Part Status |
---|---|---|---|---|---|---|---|---|---|
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CS9462410B1A
Cooling Source |
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5772 | 24x24x10mm, T411 | Bulk |
|
Active | |||
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HS-M2-SSD-21
Gelid Solutions LLC |
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3480 | ICECAP M.2 SSD COOLING KIT | Retail Package |
|
Active | |||
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HSS-B20-061H
CUI Devices |
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8515 | HEATSINK TO-220 4W ALUMINUM | Box |
|
Active | |||
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HSB03-141406
CUI Devices |
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3196 | HEAT SINK, BGA, 14 X 14 X 6 MM | Box |
|
Active | |||
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HSB02-101007
CUI Devices |
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2226 | HEAT SINK, BGA, 10 X 10 X 7 MM | Box |
|
Active | |||
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HSB28-606022
CUI Devices |
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6507 | HEAT SINK, BGA, 60 X 60 X 22 MM, | Box |
|
Active | |||
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HSE07-753045
CUI Devices |
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4221 | HEAT SINK, EXTRUSION, TO-218/TO- | Bag |
|
Active | |||
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HSB06-181810
CUI Devices |
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8871 | HEAT SINK, BGA, 18 X 18 X 10 MM | Box |
|
Active | |||
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HSS13-B20-NP
CUI Devices |
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9985 | HEAT SINK, STAMPING, TO-220, 31 | Box |
|
Active | |||
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HSB11-252518
CUI Devices |
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8729 | HEAT SINK, BGA, 25 X 25 X 18 MM | Box |
|
Active | |||
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HSB19-272718
CUI Devices |
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8752 | HEAT SINK, BGA, 27 X 27 X 18 MM | Box |
|
Active | |||
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HSB14-353518
CUI Devices |
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7890 | HEAT SINK, BGA, 35 X 35 X 18 MM | Box |
|
Active | |||
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HSE10-B20-NP
CUI Devices |
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9016 | HEAT SINK, EXTRUSION, TO-218/TO- | Bag |
|
Active | |||
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HSS-B20-065V
CUI Devices |
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6253 | HEATSINK TO-220 4W ALUMINUM | Bag |
|
Active | |||
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HSE12-B20-NP
CUI Devices |
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2407 | HEAT SINK, EXTRUSION, TO-218/TO- | Bag |
|
Active | |||
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HSS19-B20-NP
CUI Devices |
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9040 | HEAT SINK, STAMPING, TO-218/TO-2 | Bag |
|
Active | |||
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HSS20-B20-NP
CUI Devices |
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7646 | HEAT SINK, STAMPING, TO-218/TO-2 | Bag |
|
Active | |||
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HSB24-252510
CUI Devices |
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9981 | HEAT SINK, BGA,25 X 25 X 10 MM | Box |
|
Active | |||
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HSB25-282810
CUI Devices |
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4954 | HEAT SINK, BGA, 28.5 X 28.5 X 10 | Box |
|
Active | |||
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HSB26-343408
CUI Devices |
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3081 | HEAT SINK, BGA, 33.5 X 33.5 X 8 | Box |
|
Active |